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B-TTTE

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Description of Russian commercial units with extensive tables of data, circuit diagrams. 2 refs.

B.N.F Jet Test on Organic Bright Nickel Deposits

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Penetration rate of BNF jet test is thickness dependant & the method thus requires calibration. The effect of temp. on test results is meas'd. Jet test results were compared with micro-thickness meas'ts & calibration factors (which are thickness dependant) derived.

Babbit Coatings Sprayed by Electric Arc Process.

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SEM & XRD are used to study structure which differs from cast Babbit metal. Adhesion & wear of the two types are compared.

Back Extraction of Platinum Metals from Liquid Membranes in an Electric Field.

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JAE

Back Extraction of Platinum Metals from Liquid Membranes in an Electric Field.

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JAE

Back Extraction of Platinum Metals from Liquids Membranes in an Electric Field.

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JAE

Back in vogue - gold and gold effect decoration

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Back reflector layer for photovoltaic element

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Back reflector layer comprising base layer of metal or alloy and transparent oxide layer of second metal with electron affinity ca. 0.46 smaller than that of first metal

Back sputtering shield

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Target assembly for deposition chamber comprises backing plate with exposable surface around target; and target shield on exposable surface with inner diam. of shield > outer target diam.

Back to Basics - A Fresh Look at Faraday, Nernst, Hull et alia.

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Overview of Faraday's Law & theory & that of Nernst, diffusion limiting current and thickness of diffuse layer. Tables show value for "d" for different agitation regimes. Options for plating gold, tin, copper, chromium from variously valent solutions are listed. High-speed plating bath compositions are listed. Review of plating test cells, Hull, Haring-Blum, rotating electrodes & their use for current & metal distribution. Summary history is given. List of workers who have modelled & simulated current distribution. 17 refs, appendices with further refs. Sketches of cells & Hull cell plots.

Back to basics: a fundamental look at powder coatings

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Main types of powder coatings, notable properties and end uses, are described.

Back-contact solar cell

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Back-end Metallisation Process

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Back-end metallisation process in which a recess is filled with copper and which includes the step of forming a plating base on the surfaces of the recess for the subsequent electrodeposition of the said copper, and wherein subsequent to the formation of the plating base, but prior to the galvanic deposition of the copper, a modifying agent is introduced to the recess and which serves to absorb in the surface regions not covered by the plating base and to thereby modify the surface to promote copper growth thereon so as to effectively repair the initial plating base before the copper plating fill commences.

Back-End Metallisation Process.

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Back-Side Etching A tool for Making Morphology Gradients in Porous Silicon

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JES Abstract avail. online. (JE)