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A Better Understanding of the Through Hole Plating of Printed Circuit Boards

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Report with no refs. SEM, use of glass fibre cloth (to simulate the fibres in the epoxy laminate) and back-light testing were used to measure adsorption of Pd & Sn on epoxy glass, Cu & glass cloth. Differential plating, surface area differences are considered as is the Cu laminate catalytic effect.

A Better Understanding of Through-Hole Plating of Printed Circuit Boards: Pt II Multilayer Boards

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Report on through-hole plating in which hole wall coverage with Cu, measured with the back light test, is explored in terms of processing variables (incl. different baths) esp. activator and post activator times and etch-back and desmear methods. Note omission in Results section para 4, last line. Add: Table IV gives the percentage coverage estimated by backlight method. ParaV line 9 should read ".. was identical to that used in Sequences 3 (Fig 1) and 3D...."

A better way to recover nickel

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Ni is recovered by cation exchange for return to plating tank. Build up of Ni due to higher anode efficiency than cathode efficiency in plating is avoided by use of insoluble precious metal coated cathode within exchange membrane.

A biasing method for plasma immersion ion implantation and deposition process to enhance coating adhesion.

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A Biological Process for Removal of Heavy Metals and Regeneration of Sorptive Capacity

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Activated sludge was fed synthetic glucose waste and Cd soln. hydrolysed and Cd pptd as sulphide. 95% of Cd was removed. Bench scale pilot plant is being studied. Growth rate and Cd dosage levels were varied. Excess sludge was acid hydrolysed and Cdpptd. Cd free hydrolysate was channelled to batch activated sludge tank. When sorptive capacity was exhausted, it was hydrolysed and hydrolysate used to develop new batch of replacement sludge.

A blasting challenge

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Report on new Alumaglass blasting media with properties allowing one media to be used for very wide range of jobs incl. stripping paint, blast delicate aerospace parts or roughen a surface for ptfe application. Comp'n is 20% alumina, 54% silica, bal. calcia, soda etc.

A brief discussion on compatibility of phosphating treatment with electrophoresis coating.

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A brief discussion on factors affecting binding force of Cu-Ni/Cr plating.

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A brief discussion on how to carry out cleaner production in electroplating enterprises.

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A brief discussion on key points of low temperature iron (alloys) plating technology.

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A brief discussion on maintaining mass concentration of trivalent chromium in chromium plating solution.

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A brief discussion on metal degreasing and cleaning.

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A brief discussion on pretreatment for stainless steel plating.

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Stainless steel is passivated most easily in air, forming a dense passivation film, which has a very good corrosion resistance. With the development of various industries, the application of stainless steel is expanding rapidly, resulting in an increasing demand on functional electroplating on stainless steel. By using chemical activation and pre-plating pretreatment method to remove the passivation film on stainless steel parts, the surface of stainless steel can form a coating with a very good adhesion, thus many metals can be plated on stainless steel substrate.

A brief discussion on production practice of oxidation process for steel parts.

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A Brief Discussion on some Troubleshooting Cases in Aluminium Anodizing

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