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David beats Goliath
Describes innovative concept for rapid colour changes in powder coating at Ophardt Pulverlackiermaschinen GmbH & Co. in co-operation with Brabantia, Emmerich, Germany.
Dawn of the flip chip era
Interview with head of Zevatech, US placement company, predicting that flip chip is set to be dominant method for placing VLSI devices.
Day after day - 150,000 square meters
Account of Messrs Homanit, at Losheim in Germany who coat MDF and HDF boards 24hrs a day, 7 days a week. Machines are never idle except for a 90 min colour or pattern changeover. Comments on markets, 2 dozen photos show operations. Problems include very high loading on paint surface when boards are stacked. Quality assurance is enforced at every stage. Value is added by drilling and/or machining boards for self-assembly furniture use. The importance of the works laboratory is emphasised.
Day in the Life of a Plating Shop Outside Guangdong
Account of the fairly basic conditions & operation methods at a Chinese plating shop. Cont'd p. 40.
DBD plasma improved spot repair of automotive polymer surfaces.
SFEN Plasma activation effects on automotive polymers by low temperature plasma at atmospheric pressure have been studied. The aim was the improvement of the polymer surface polarity in order to replace the use of adhesive layers before application of lacquering. Two different concepts of dielectric barrier discharge, direct and indirect plasma treatment, were applied. The efficiency of such plasma treatment was determined by adhesive pull strength tests and surface energy calculations. It was shown that both plasma treatment methods allow a significant increase in surface polarity up to a factor of 20 and adhesive pull strength of lacquers up to a factor of 29 respectively. In comparison to indirect surface treatment, the direct treatment features a higher efficiency in terms of increasing both, polarity and adhesive pull strength.
DBD treatment of polyethylene terephthalate: Atmospheric versus medium pressure treatment.
DBE as an alternative solvent
Interview with senior Du Pont representative who extols merits of dibasic esters (DBE) as eco-friendly organic solvent for use in place of chlorinated & other solvents.
Dibasic Ester IB is variant of DuPont family of cleaning & degreasing solvent with even lower vapour pressure, lower solubility in waer, higher flashpoint. Brief description of its uses.
DC and Periodic Reverse Electroplating of Semiconductor Surfaces having Adjacent p-Type and n-Type Areas
JES Abstract avail. online. (JE)
DC current supplies in modern plating plants
Overview by major rectifier mfr, charts move from "buying a rectifier" to "installing a dc supply system". Block diagrams show air-cooled thyristor system and overall dc supply system. Review of options with histogram showing selenium & silicon type units in the range 10V/1200 Amp. Discussion of units with mechanical and electromechanical setting modes & thyristor settings. Comments on ripple with graph showing this. Other aspects incl. process operation, location of units, residual ripple. Selection of unit is guided by decision-making tree,
DC discharge plasma modification of chitosan/gelatin/PLLA films: Surface properties, chemical structure and cell affinity.
DC Electrodeposition of Thick SmCo Films for MEMS Applications.
Dc power source for electrolytic colouring of anodised aluminium
Describes A10,000 power supplies of Rapid Electric Co. Inc., Brookfield, CT, for use with P3 Almecolor electrolytic coloring process for Al of Amchem Products Inc., Ambler, PA.
DC Power supplies and bath agitation - DGO Meeting
Meeting with disc'n of rectifier types, esp. control modes, special applications in hard chromium plating & aluminium anodising. Also disc'n of pulse rectifiers used for printed circuit boards, strip plating, copper- nickel-chromium and for anodised Al. Solution agitation using eductor or "Ser-ductor" was explained. Its various actions incl. homogenising bath conditions (composition, temperature) and locally increased mass-transport by convection enhancement.
DC Power Supplies for Electroplating
Data for motor generator sets is plotted. Types of power regulators are compared. Energy losses in busbar runs are tabulated. Cooling, diode efficiency and power factors are discussed.