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Fabrication of cobalt nanowires by electroless deposition under external magnetic field.

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JES

Fabrication of Complex Printed Circuit Boards - Report of a Symposium

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Report on symposium at Esslingen with contributions on layout and user requirements, board properties, new trends in drilling technology; dry film resist, multilayer pressing, chemical hole cleaning, through contacting, photo soldermasks, hot tinning & Quality Assurance.

Fabrication of composite coating comprising bioactive calcium and sodium titanates on titanium using calcium hydroxide slurry containing sodium ions.

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Fabrication of composite materials using atomic layer deposition.

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Stacked particles are assembled, then embedded in ALD deposited matrix. A vapour phase etch cycle can be intermitently used to unclog interstices.

Fabrication of Conducting Probe Tips

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Fabrication of conductive thin films on precursor polyimide via chemical reduction of nickel (II) complex.

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Fabrication of Conductive/Non-Conductive Nanocomposites by Laser Evaporation.

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A composite layer of a sorbent, chemoselective, non-electrically-conducting polymer and nano-particles of an electrically conducting material dispersed throughout the polymer is formed on a substrate by pulsed laser deposition, matrix assisted pulsed laser evaporation or matrix assisted pulsed laser evaporation direct writing.

Fabrication of CoNiMnP-BaFe12O19 nanocomposite coatings by electrodeposition.

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Title nano-composite coatings with magnetic properties are of potential interest in MEMS devices. Their electrodeposition from an aqueous bath containing nanoparticles of BaFe12O19 is reported. Incorporation of these into the deposit is shown to favour electrodeposition of cobalt and manganese while repressing that of nickel and phosphorus. A maximum incorporation of the second phase of 22wt% was recorded and the effects of this on grain size and preferred orientation are also discussed. Values for magnetic energy density and coercivity are given. 35 refs

Fabrication of Controlled Geometry STM Tips by Electrochemical Etching & Paraffin Coated ECSTM Tips

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Etching of Pt(0.8) Ir (0.2) in 3M KCN + 1M NaOH sol'n & paraffin coating by pulling out. 12 refs

Fabrication of Controlled Geometry STM Tips by Electrochemical Etching & Paraffin Coated ECSTM Tips

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Etching of Pt(0.8) Ir (0.2) in 3M KCN + 1M NaOH sol'n & paraffin coating by pulling out. 12 refs

Fabrication of Cooling and Heat Transfer Systems by Electroforming.

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Cooling channels for rocket motors etc using mandrel and non-conductive materials such as PMMA to build closed channels with electrodeposited nickel or copper.

Fabrication of Copper Film on Aluminium Nitride by Novel Electroless Plating

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JES Abstract avail. online. (JE)

Fabrication of Copper Laminated Dielectric

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Fabrication of copper micro-pattern on organic resin board by electroless plating and laser irradiation.

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A printed circuit board with a fine Cu pattern was fabricated by electroless plating and laser irradiation. A glass fiber-reinforced epoxy resin plate was immersed in a Pd*2+ solution and a Cu layer was then deposited on the epoxy resin by Cu electroless plating. After Cu plating, the Cu deposited specimen was irradiated with a pulsed Nd-YAG laser through an iris diaphragm and a convex lens to remove the Cu layer locally in air or doubly distilled water. The width of the Cu removed area increased with increasing the laser power and with decreasing the scanning rate of the laser beam. When laser irradiation was performed in doubly distilled water, the Cu layer around the laser-irradiated area rolled up, resulting in the formation of less precise patterns. Fine Cu-pattern coils with 60 µm width and 20 µm intervals were fabricated on the epoxy resin by laser irradiation in air.

Fabrication of copper micro-tubes by electroless deposition with an etched porous aluminum template without using sensitization and activation.

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MCP Cu micro-tubes were fabricated by electroless deposition in an etched porous aluminum membrane without sensitization and activation. The aluminum membrane having square holes was prepared from a high-purity aluminum foil electrochemically. The aluminum reduced Cu2+ into Cu and the formed Cu nuclei served as the catalyst for the further reduction of Cu2+. The auto-catalysis substituted the preparation of a novel metal catalyst through sensitization or activation and greatly simplified the deposition process. A two-step operation was developed to improve the deposition of copper, which enhanced the deposition reaction inside the micro-pores. With the help of the membrane, Cu micro-tubes with an outer diameter of about 1-2 µm and a wall thickness in the order of tens to several hundreds nanometers were obtained. The surface-deposited copper layer served as a substrate for the copper micro-tubes, and as the result the resulted material possessed strong mechanical strength as well as high surface area.