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Fabricating a switching device by anodizing
Method for fabricating switching device by anodizing in which insulating film formed by anodizing is interposed between lower and upper electrodes.
Fabricating an Electroformed Mold for Precision Molding.
106: 184940 A method for fabricating an electroformed mold for precision molding involves the following steps: (1) chem. or electrochem. passivating the transfer side of a metal mandrel, in which the electrode potential of the transfer side is defined, to form a peelable film on the transfer side; and (2) fabricating the mold by electroforming. Optionally, the electrode potential may be defined to up to -150 mV vs. SCE by keeping in pure water for up to 25 min. Thus, a nickel stamper for video disks was fabricated by passivating a Ni mother while keeping the electrode potential to -145 mV (vs. SCE 20°), and Ni electroforming.
Fabricating an ink-jet printhead
Micromechanical device is fabricated by depositing sacrificial layer of removable material on main surface, configured as negative mould of cavity defined in substrate; depositing permanent layer and polishing permanent material to expose sacrificial layer which is then removed.
Fabricating and inspecting coatings
Method comprises depositing coating and determining •1 physical property using eddy current techniques. Eddy current probe is positioned by manipulator. Thickness, density, abradability and/or erosion resistance are measured.
Fabricating circuitry on substrates having plated through-holes
Process comprises providing dielectric substrate with conductive layer; applying 1st photoresist 2-4µm thick, exposing and developing, to define circuit pattern; laminating 2nd photoresist 1-5 mil thick near trough-hole(s) and removing it where fine line circuitization is to be provided; then etching exposed conductive layer to provide circuit pattern and removing remaining 2nd photoresist.
Fabricating Closed Channels by Electroforming
3 diff't methods for forming closed channels are illustrated with openings down to 750 µm. sq. One method utilises Kirkendall diff'n effect using Sn-Pb alloy and Au. 9 refs.
Fabricating Computer Printer Character Bands by Electrodeposition
Title bands were electroformed in Ni-Co, Ni-Fe, Ni-Mn or Ni-Co-Mn & Ni-Fe-Mn alloys. Anodes were titanium baskets with metals required. Deposited characters are finished with chromium plated backing.
Fabricating Copper Polyimide Substrates
Polyimide surface is made hydrophilic, catalysed & electroless plated with a metal other than Cu, then Cu plating (or electroless Cu). Heat treating in inert atmosphere.
Fabricating Damascene Structures in Mechanically Weak Interlayer Dielectrics.
A copper damascene process for a mechanically weak low k dielectric layer. Electropolishing is used to etch back the copper. A sacrificial conductive layer beneath the barrier layer assures complete planarization of the copper.
Fabricating dendritic powder materials for high electrical conductivity paste
Copper dendrites are formed by electrodeposition at varying current densities and using heat treatment to agglomerate dendrites.
Fabricating Electroplated Substrate
Electroforming is used for fabrication of thin film photoelectric devices.
Fabricating Hybrid Magnetic Film
Multilayer magnetic film devices in which first magnetic layer is vacuum dep'd, second layer electroplated with electroplated copper between the two layers. Subsequent etching stages are detailed. Cites US 3375503.
Fabricating indium phosphide/indium gallium arsenide phosphide buried heterostructure semiconductor lasers
SC laser with high modulation band width is made by using InGaAsP cap layer and InGaAs P active layer of different crystal structure. Channels are anisotropically etched through cap, cladding and active layers and partially through buffer layer. Active and cap layers are laterally etched and semi-insulating material is overlays sidewalls. Further etching leaves thin wall of semi-insulating material surrounding active layer. 1.3µm InGaASP lasers with 3 dB bandwidths of 24GHz and intrinsic resonance frequencies >22GHz can be fabricated.
Fabricating Multichannel Plates for Image Intensifiers by X-Ray Lithography & Microelectroforming
Title products are microstructures with very high aspect ratios. Fabrication method using electroforming to produce negative mould which is then filled with molten glass, is described. Precursor of LIGA method (q.v).
Fabricating multisegment ridge wave guides
Process involving forming semiconductor layer structure; depositing metal layer; masking and etching.