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Fabricating plated wire ferromagnetic memory element
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Means for plating copper films of precise surface roughness over which Permalloy films can be deposited. Cu cyanide, fluoborate and sulphate are claimed. It is claimed that the much-desired mirror finish may not, in fact, be advantageous.
Fabricating Printed Circuit Board with Recessed Pads
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Fabricating silicon dioxide film
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Fabricating silica film used as core layer on core layer of cladding layer of optical waveguide, by coating soln containing polysilazane and solvent on substrate; and sintering at 900-1100°C.
Fabricating sputter induced microtexturing of thin film magnetic disc media
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Process comprises depositing conditioning layer of oxide of Ta or Ti, providing seed layer receptor; sputter depositing eutectic alloy of In and Bi alloy globules, defining roughened exposed exterior; sputter depositing thin film of magnetic media; exterior being micro-textured; globules comprising 65%wtBi-35%wt In and having m.pt ca. 90°C.
Fabricating thin film solid oxide fuel cell
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Solid oxide fuel cells fabricated by sputtering Zr-Y target for deposition of yttria-stabilised zirconia electrolyte films on LSM substrate/air fuel electrode.
Fabricating thin films
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Process comprises spraying soln or dispersion of film material from nozzle onto substrate within vacuum vessel at pressure ca. 1x10E-4 Pa; and heating deposited film.
Fabricating transparent indium tin oxide films by magnetron sputtering method
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Fabricating via Connectors through Semiconductor Wafers
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101 14070 Engl. Laser-drilled holes through a wafer are filled with electroformed vias by first metallising both faces of wafer and then Cu forming.
Fabricating Via Connectors through Semiconductor Wafers by Electroforming
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Laser drilled holes through semiconductor with metallised surface allow via to be produced by electroforming.
Fabrication & characterisation of uniform metallic nanostructures using nanochannel glass
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JES Formation of 2D arrays of identical nm size metallic wires with high aspect ratios & packing densities > 3 x 10E9 elements per sq. cm, by electrodep'n (electroforming) into nanochannel glass templates or mandrels. Preliminary results on formation of nm size metallic tubes is offered. SEM's & TEM's show structures, hysteresis loops show magnetic properties of nickel or cobalt nanowires and photos of platinum nanotubes also shown. 25 refs
Fabrication & Post-Fabrication Cleanup of Stainless Steels
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Cleaning S/S after welding & similar operations, e.g to remove organics or embedded iron, scratches which can initiate corrosion. A "spot test" for detection of embedded Fe using ferricyanide is given. Prevention of contamination in welding. 7 colour photos. No refs
Fabrication and adhesive properties of thin organosilane films coated on low carbon steel substrates.
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Fabrication and analysis of anti-corrosion coatings on in-situ TiB2p reinforced aluminum matrix composite.
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Fabrication and application of chemical vapor deposition diamond-coated drawing dies
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DIAM Diamond coating has been fabricated by straight hot filament CVD passing through interior hole of drawing die using mixture of hydrogen and acetone as source gases. Substrates are drawing dies made by cemented carbides with large apertures (diam. > 2 mm), and are pre-treated incl. acid leaching cobalt by scratching substrate by diamond powder and decarburizing tungsten carbide substrate by microwave plasma. Adhesion strength of diamond coatings can meet need of practical drawing wires. Working lifetime of diamond-coated drawing die can be increased by factor of 5:10.
Fabrication and application of copper sub-micro-doughnut with electroplating method on patterned nickel template.
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