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Fabrication metal micropatterns

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Trenches are created in polymer layer on substrate, and insulating sidewall is created on one side only of trench wall. Trenches are metal-filled by electrodeposition after which polymer layer is removed without removing insulating layer.

Fabrication method for surface gratings using a Faraday cage in a conventional plasma etching apparatus

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Directional etching in a conventional plasma etcher is achieved by placing substrate in Faraday cage fixed on cathode, whose top plane is gridded and slanted with respect to substrate surface. Etching direction is determined by angle that gridded plane makes with substrate normal. Surface gratings with symmetric or a symmetric V-grooves are obtained using cage covered with 2 slanted grid planes. Slopes of gridded planes determine cross-sectional shape of V-groove.

Fabrication Methods for Ceramic Coating and their Anti Corrosion.

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Corrosion at boiling pt for 24 hrs in 15 different solutions (acids, alkalis, salts) is studied of plasma sprayed alumina with fluoropolymer or epoxy phenolic outer sealant. Open circuit potentials are listed. 4 refs

Fabrication of 3D photonic crystals using interference lithography and electrodeposition.

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Fabrication of a 3D Conductive Body with Underlying Conducting Tracks

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Fabrication of a Cutting Blade from a Wafer having a Blade Separation Structure.

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Wafer is first etched, then scored to define and form component.

Fabrication of a diamond-based imprint mold by applying diamond CVD on silicon master molds for a glass microlens array.

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Fabrication of a diamond-based imprint mold.

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Fabrication of a hierarchical aluminum oxide surface with micro/nanostructures via a single process and its application as a superhydrophobic surface: Simple sintering method with an aluminum microsized powder.

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SURF A hierarchical aluminum oxide surface with micro/nanostructures was fabricated via a single pressureless sintering method. About 70-µm-thickness pile of aluminum powder (i.e., sub-10-µm) was laid on a sapphire substrate with an area of 10 × 10 mm*2, and the substrate was placed in the middle of the furnace. Using a working temperature of 900 °C, 1-, 2-, 4-, 6-, and 8-h sintering processes were performed. After this process, a plate with a micro-spherical shape similar to the initial morphology of the laid aluminum powder was formed via adhesion between the aluminum powders. In addition, needle-like nanorods were formed at the surface of the plate. Therefore, an aluminum oxide surface with hierarchical micro/nanostructures was fabricated. In addition, a mechanism was proposed to explain the fabrication process. Several types of experiments with varying temperatures, atmospheres, purging times, and substrates were performed to confirm the proposed mechanism. Finally, with the aid of a simple hydrophobic surface treatment, a superhydrophobic surface with low hysteresis was fabricated.

Fabrication of a high functional light guide plate replicated by micro nickel mold and its application for LED lights.

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Fabrication of a High Heat Dissipating Double-Sided Printed Circuit Board

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Aluminium is anodised to form alumina films. Polyimide mixed with fine-ground Al nitride powder is used as binder to improve thermal conductivity. Such Al-based pcb's are prepared after lamination, etching and other stages. Thermal resistance testing gives value of < 0.125 K°/W-sq, meter. Mathematical equation for heat dissipation by conductive transfer is shown. Process flow sheet shows 21 stages. Disc'n of thermal conductivity and AlN content in binder, with graph plotting this. Table summarises thermal properties of the boards. 7 refs

Fabrication of a High Surface Area Diamond-Like Carbon or Dirty Diamond Coated Metal Mesh for Electrochemical Applications

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Fabrication of a High Surface Area Diamond-Like Carbon or Dirty Diamond Coated Metal Mesh for Electrochemical Applications

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Fabrication of a mask

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Mask is fabricated by depositing Cr layer on quartz plate; depositing oxidizable material layer; forming photoresist pattern; etching Cr and oxidizable material layers using photoresist pattern as mask; and extending oxidizable material by oxidizing to form phase-shifter.

Fabrication of a NCD microelectrode array for amperometric detection with micrometer spatial resolution.

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DIAM Describes fabrication of a boron-doped nanocrystalline diamond (NCD) 3 3 high-density microelectrode array (MEA) for amperometric measurements, with a single electrode area of 3 5 µm2 and a separation in the µm scale. The NCD microelectrodes were grown by hot filament chemical vapor deposition (HFCVD) on a double-side polished sapphire wafer in order to preserve the diamond transparency. Bias enhanced nucleation (BEN) was performed to ensure a covalent adhesion of the films to the substrate. A current background noise of less than 5 pA peak to peak over a 1 kHz bandwidth resulted from an electrochemical investigation of the new device, using 100 mM KCl solutions and ferrocyanide red-ox couples. Cyclic voltammetry measurements in physiological buffer solution and in the presence of oxidizable bio-molecules strengthened its suitability for bio-sensing. When compared to a 2 2 NCD microelectrode array prototype, already used for in vitro cell measurements, the signal to noise ratio of the amperometric response of the new 3 3 device proved twice as good. In addition, the optical transmittance of the boron-doped thin layers exceeded 40% in the visible wavelength range. The excellent electrochemical properties of NCD electrodes and the transparency in combination with the high spatial resolution make the new 3 3 NCD MEA a promising tool for electrochemical sensing in a variety of applications, ranging from medical to industrial, in neutral or harsh environments.