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Fabrication of a Precision Die by Chemical Milling of Fine Lines

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Fabrication of a printed circuit on aluminium or aluminium-magnesium alloy substrate

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Fabrication of printed circuit on Al or Al-Mg alloy substrate by removing oxide film and applying anodic 10-20µm thick oxide coating in weak acid soln at 1-5 A/sq.dm.

Fabrication of a probe with coated tip

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Fabrication of a Scanning Near-Field Optical Microscopy Probe using Electroless Nickel-Phosphorus Plating under Ultrasonic Irradiation.

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Fabrication of a semiconductor device

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Method comprising depositing amorphous silicon film on hole in insulating film; covering substrate by low-pressure CVD using thermal decomposition of disilane gas at 400-500°C and depositing tungsten film by CVD.

Fabrication of a TiO2 photocatalyst by anodic oxidation of Ti in an acetic acid electrolyte.

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SURF Ti substrates were anodized in an aqueous acetic acid solution to produce photocatalytic TiO2 films. The TiO2 films were comprised of the anatase phase, but the crystallinity and photocatalytic activity were low, in contrast to films produced by Ti anodization in a sulfuric acid electrolyte. After annealing, the anatase film crystallized and the photocatalytic activity was greatly enhanced. For the anodizations carried out in 0.5 and 2 M acetic acid, nonzero current was maintained for the duration of anodization, unlike the other concentrations. We interpret this phenomenon as the layered structure formation from the holes on the substrate surface. Highly crystallized anatase TiO2 therein was thought to mainly contribute to photocatalysis.

Fabrication of a Transparent Conductive Film

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Fabrication of a visible-light-responsive photocatalytic antibacterial coating on titanium through anodic oxidation in a nitrate/ethylene glycol electrolyte.

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SURF To provide semi-permanent antibacterial function for titanium medical implements, such as micro-tweezers, hemostatic forceps, and needle holders, a visible-light responsive nitrogen-doped titanium dioxide (TiO2) layer that strongly adheres to Ti materials was fabricated through anodization in an electrolyte comprising ammonium nitrate in ethylene glycol, followed by heating at 723 K in air. The predominant structure of the oxide layer was TiO2 with a rutile structure that contained ca. 1 at.% of incorporated nitrogen. The outward appearance of the oxide layer was quite smooth, and the topographic microstructure was a flat surface that included small pores. The thickness of the surface layer was approximately 10 µm, and the layer strongly adhered to Ti substrates. This fabricated anodic layer acted as a photocatalyst both under UV-light and visible-light illumination, and showed excellent antibacterial performance under both types of illumination. Anodic oxidation in a nitrate/ethylene glycol electrolyte is an innovative surface modification technique that can be used to simply form visible-light responsive photocatalytic antibacterial coatings on biomedical Ti materials.

Fabrication of advanced transistors with plasma doping

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SURF Plasma doping (PLAD) has recently been developed to become a reliable doping technology for the silicon industry. The extreme difficulty of implanting the doping species at the very low energy required by very advanced transistor technology (sub-0.1 µm) by standard ion implantation is strong motivation for device manufacturers to explore alternative doping technology, such as PLAD. It is shown how the PLAD technique was used to improve the ultra-shallow junction (USJ) process formation and the USJ characteristics. The authors integrated this process into a very advanced industrial complementary metal-oxide semiconductor (CMOSD) process flow. The electrical performance of p-type metal-oxide semiconductor field-effect transistors (pMOSFETs) fabricated by PLAD or ion implantation is compared. The benefit of using the PLAD technique is increased as the transistors are shrunk from 0.18 down to 0.09 µm.

Fabrication of Ag nanoparticles dispersed in PVA nanowire mats by microwave irradiation and electro-spinning.

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Fabrication of Ag/Y2O3-stabilized ZrO2 composite films by metallorganic chemical vapour deposition

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JES Composite films of Ag and Y2O3 stabilized zirconia were prepared by simultaneous MOCVD of metal and ceramic. Aerosol-assisted precursor delivery of toluene soln. of precursors Zr(tfac)4, Y(hfac)3, and (hfac)Ag(C4H6OS)2 was used to deposit films with Ag vol. fractions ranging from 0.007 to 0.60 (hfac = hexafluoroacetylacetonate, tfac = trifluoroacetylacetonate). Film morphology and room-temp. resistivity varied with Ag content. Resistivities for Ag vol. fractions > 0.30 were consistent with typical granular composite films; however, at Ag vol. fractions < 0.10, much lower resistivities were found than typically reported. Percolation behaviour of films is analyzed and possible explanations for resistivity results are discussed.

Fabrication of amorphous iron boron alloy films by contact plating method and their magnetic properties

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Amorphous Fe-B film was formed by means of a contact plating method in which copper foils in contact with aluminium wire were used as the substrates. The boron content of the film was controlled in the range 0-28 at.% by adjusting the KBH4 concentration in the electrolyte. Below 40°C Fe80B20 amorphous films were formed.

Fabrication of amorphous iron-boron electrodeposited films for micro-magnetic devices

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Amorphous Fe-B alloy films were electrodeposited from a bath containing a KHB4 concentration >300 mM and a B concentration > 20 at% at 30°C. Films with low coercivity and high magnetostrictive constant, comparable to values obtained with sputtered films were produced by using a combined complexing agent of KNaC4H4O6 and ammonium sulphate. ESCA measurements showed that 80% of the boron was chemically bound with iron and the remaining 20% was bound with oxygen.

Fabrication of an Array of Precision Nozzles by Through-Mask Electrochemical Machining

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Report on manufacture of inkjet printer heads with sketches & photos of finished orifices & details of mask & etch procedures. 7 refs

Fabrication of an Article having a Thermal Barrier Coating System

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An article protected by a thermal barrier coating system is fabricated by providing an article substrate having a substrate surface; and thereafter producing a pre-oxidized bond coat on the substrate surface by depositing a bond coat ont he substrate surface, the bond coat having a bond coat surface, and controllably oxidizing the bond coat surface to form a pre-oxidized bond coat surface. A thermal barrier coating is thereafter deposited overlying the pre-oxidizing bond coat surface. The thermal barrier coating is yttria-stabilized zirconia having a yttria content of from about 3% by weight to about 5% by weight of the yttria-stabilized zirconia.