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3848 results. per page « 1 2 3 4 5 6 7 8 9 10 11 »

Half-Life Rinsing

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Simple mathematical treatment of half-life rinsing with equations and graphs. 1 ref.

Halide & Thiourea Free Palladium Plating Bath

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Halide Containing Chromium (VI) Plating Bath

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Halide etching of semiconductor substrates

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Method of chemically etching native oxides from substrate with halide gas in presence of water vapour.

Halide etching of semiconductor substrates

Relevancy:  

Method of chemically etching native oxides from substrate with halide gas in presence of water vapour.

Halide etching of semiconductor substrates

Relevancy:  

Method of chemically etching native oxides from substrate with halide gas in presence of water vapour.

Halide etching of semiconductor substrates

Relevancy:  

Method of chemically etching native oxides from substrate with halide gas in presence of water vapour.

Halide ion effect in electroless nickel plating

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JAE Study in acid electroless bath showed halid ions to have significant effect which could not be fully explained. Correlation between stability constants of halide ions with palladium (II) ions & deposition rate is proposed. Activation energy (Arrhenius plots), structure of deposit and phosphorus content are also reported as are temperature & pH effects. Anodic & cathodic polarisation plots are shown, EM's show deposits. 22 refs

Halide Ion Selective Electrodes

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Disc'n of Cl, Br & I ISE and their use in specific plating baths, viz sulphamate Ni, Watts Ni, Ni-Fe, Fe, acid zinc (sulphate - chloride), acid copper, anodising baths, feed water, cetyl trimethyl ammonium bromide add'n agent and (through the iodide) for CN anal. 17 refs.

Hall effect of photocurrent in CVD diamond film.

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Hall stratum filtered cathodic arc source for carbon plasma.

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Halocarbon-Free Environmentally Friendly Anti-Tarnish Process for Silver

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Purely aqueous system (not emulsion) free from halocarbon solvents, is described. Process offered by Degussa. Abstract only.

Haloform plasma modification of polyolefin surfaces.

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Halogen additive for alkaline copper plating zinc diecastings

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Uses phosphonate based Cu(II) bath with halogen ion additives.

Halogen additives for alkaline copper plating of zinc diecasting

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Phosphonate-based Cu(II) bath with halogen ions.