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Halogen Gases for etching aluminium

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In manufacture of SC device, Al (alloy) is etched using gaseous mixture of Cl2 interrelated group and Br interrelated group.

Halogen tin plating composition

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Composition comprises acid aq. mixture of stannous Sn halide and salt having alkaline cation and O-containing inorganic N or S acid anion reducible to lower oxidation state.

Halogen tin plating process

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Sn layer is electroplated on Fe metal substrate from acid bath comprising Sn(II) halide. and salt having alkaline cation and O-containing inorganic acid anion reducible to lower oxidation state.

Halogen tin plating solution

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Bath for plating onto iron or steel has stannous halide, salt with alkaline cation & nitrogen or sulphur acid anion reducible to a lower oxidation state.

Halogen-free secondary coatings for fibre-optic indoor cables

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Overview of halogen-free, fire retardant cable coatings, with sketches showing buffer designs, table of thermochemical properties, oil resistance. Graphs show fire performance, combustion gases & toxicity. Histogram shows water & moisture uptake & absorption. Processing details are given incl. melt flow index & temperature cycle attenuation values. 8 refs

Halogen-free trivalent chromium conversion coating.

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Trivalent chromium conversion coatings are provided on a metal substrate wherein the trivalent chromium conversion coating has a halogen content of 1 atom % maximum.

Halogen-Resistant, Anodized Aluminium for use in Semiconductor Processing Apparatus

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It was discovered that the formation of particulate inclusions at the surface of an aluminium alloy article which inclusions interfere with a smooth transition from the alloy surface to an overlying aluminium oxide protective film, can be controlled by maintaining the content of mobile and nonmobile impurities within a specific range and controlling the particulate size and distribution of the mobile and nonmobile impurities and compounds thereof; by heat-treating the aluminium alloy at a temperature less than about 330°C; and by creating the aluminium oxide protective film by employing a particular electrolytic process. When these factors are taken into consideration, an improved aluminium oxide protective film is obtained.

Halogen-Resistant, Anodized Aluminium for use in Semiconductor Processing Apparatus.

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The formation of particulate inclusions at the surface of an aluminium alloy article, where these interfere with the anodizing can be controlled by maintaining the content, particulate size and distribution of mobile impurities within a specific range by heat-treating the aluminium alloy at a temperature less than about 330°C.; and by creating the aluminium oxide protective film by employing a particular electrolytic process. When these factors are taken into consideration, an improved aluminium oxide protective film is obtained with fewer defects.

Halogen-Resistant, Anodized Aluminium for use in Semiconductor Processing Apparatus.

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It was discovered that the formation of particulate inclusions at the surface of an aluminium alloy article, which inclusions interfere with a smooth transition from the alloy surface to an overlying aluminium oxide protective film, can be controlled by maintaining the content of mobile and non-mobile impurities within a specific range and controlling the particulate size and distribution of the mobile and nonmobile impurities and compounds thereof; by heat-treating the aluminium alloy at a temperature less than about 330°C.; and by creating the aluminium oxide protective film by employing a particular electrolytic process. In most cases, an improved aluminium oxide protective film is obtained.

Halogen-Resistant, Anodized Aluminium for use in Semiconductor Processing Apparatus.

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When Al (or alloy) is anodised, presence of particulate impurities at metal surface can detract from quality of interfacial region. By heat-treating the metal or alloy at < 300°C prior to anodising and using modified anodising conditions, an alumina film with improved protective properties is obtained.

Halogenated solvent use could be halved, study claims

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Study by Metropolitan Water District of Southern California and Environmental defense Fund suggests that US businesses could reduce consumption of halogenated solvents (trichloroethylene, perchloroethylene, 1,1,1-trichloroethane, methylene chloride and 1,1,2-trichloro-1,2,2- trifluoroethane) by 58% in decade. Case studies are provided.

Halogens can protect from high temperature oxidation

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Halogens are usually understood to accelerate corrosion. However titanium aluminide layers are protected by their action. Sketches show typical coating & interface structure, chemical equations for the action of halogens are shown. Graphs show thermogravimetric data at 900°C and effects of bromine & fluorine-implanted coatings. Their presence promotes a thinner alumina outer coating rather than Ti-Al mixed oxide. 9 refs

HAM celebrates a double event

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Visit to Messrs HAM, manufacturers of hard-metal tools for printed circuit board machining, such as drills. Photos show plant, text describes activities.

Hammond Oscillating-Spindle Electrolytic Grinder

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Hand Held Gas Propelled Sandblaster

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