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Immersion Copper Coating of Steel

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Use of complexant to obtain bright adherent Cu coatings is reported.EDTA, DEA & tartaric acid were used, the last being best. Weight gain vs. time & potential time plots are shown. Adhesion was measured using tape pull-off test. 11 refs.

Immersion copper coating of steel

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When steel articles are dipped in acidic CuSO4 soln., Cu deposits on them by galvanic displacement. Deposits are porous and non-adherent. Suitable complexing agent for such soln. to get bright, adherent deposits of Cu on steel is reported. Effect of immersion time on deposit thickness and potential-time behaviour of steel electrode with/without incorporation of complexing agent were studied. Effect of temp. on potential-time behaviour was reported.

Immersion Copper Plating Bath

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Immersion Deposit Pretreatments for Electroplating on Aluminium - Literature Review

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40 refs are cited in review covering zincate process, sol'ns using fluoride anions, Zn alloy immersion process, Biased AC plated brass, stannate, the Alcoa 661 process and related methods. Deposit adhesion is discussed with data for Ni.

Immersion deposited cathodes

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Substrate metal capable of absorbing H is interdiffused with 2nd metal, most of which is leached from surface to leave surface including absorbed H, and immersed in electroless plating bath.

Immersion electrocoat paint fillers

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Automotive filler-coats have now been replaced with 2-layer electrocoat. After curing, this becomes electrically conductive, allowing further E-coat painting to take place. Conductivity is achieved by loading with soot particles. The main characteristics of 1st & 2nd coatings are noted, both are cathodically deposited, the 1st is epoxy, the 2nd PUR. Histograms show curing temperature vs. coating thickness. Flowsheet floorplan is shown, the benefits both economic & environmental are set out and photos & text describe Daimler-Chrysler production lines.

Immersion gold deposition

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Au is deposited on metal or metallized plastic from soln. containing Au(III) complex, carboxylic acid and/or mineral acid to pH 0.1-6.0.

Immersion gold deposition from a chloroauric acid–choline chloride solution: Deposition kinetics and coating performances.

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SURF A simple, green, stable, and acidic solution was developed based on choline chloride (ChCl) and chloroauric acid (HAuCl4) for immersion gold deposition onto electroless nickel substrate by galvanic displacement process. The relationships between gold (Au) deposition rate and solution parameters were investigated. The optimal conditions were determined as 1.0 g·L- 1 HAuCl4, 500 g·L- 1 ChCl, 80 °C, pH 0.5 ~ 2.5. The kinetics equation of IG deposition process was deduced and the corresponding activation energy was calculated to be 28.03 kJ·mol- 1. At the same time, the performances of the coatings were investigated. The results revealed that Au coatings prepared from chloroauric acid–choline chloride (Au(III)-ChCl) solution had excellent properties on solderability and corrosion resistance.

Immersion Gold Plating

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Immersion Gold Plating Bath

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Immersion gold plating semiconductor materials.

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JES Presents a basic immersion gold formulation which will deposit adherent gold on the surface of silicon or germanium. By modification of the basic formula, adherent gold may also be deposited on nickel, kovar, copper, solder, and other base materials. This formulation operates in the acid range at temperatures from 150° to 200°F depending on the application. Applications on semiconductor materials include: (a) adherent base for overplating; (b) with overplating, provides good bondability or solderability; (c) provides a conductive surface for uniformly plating high resistance semiconductor materials; (d) controlled source of gold for diffusion. Similar and other applications are obviously obtainable on other base materials used in manufacture of semiconductor products.

Immersion Heating Element for Hot Dip Zinc Galvanising

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Immersion member for molten metal bath

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Immersion member for molten metal bath is made by forming thermal sprayed coating comprising tungsten boride 1-50, Ni, Co, Cr and/or Mo 3-25 % wt, remainder W carbide; impregnating fluid containing CrO3 on sprayed coating to fill cracks and micropores; and baking to produce Cr2O3-B2O3 system glass in cracks and micropores.

Immersion method.

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Composition and method for inhibiting corrosion. Metals and metal alloys are treated with compositions which contain inorganic and organic acids that prevent oxide formation on the metals and metal alloys.

Immersion Nickel Plating onto Silicon

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