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Immersion Non Electrolytic Tin Lead Alloy Plating Process

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Title process followed by fusing of solderable Sn-Pb deposit over copper is reported. It offers alternative to HAL & electrodep'n + selective stripping or inhibitor coating. Typical thicknesses are 4 to 8 microns, 65 to 75% Sn. Graph shows rate of dep'n (thickness vs. time), 3 dimensional graph of thickness after fusing, performance as function of load number (deposition composition) and cost data. Increase in Cu conc'n in the bath is also plotted. Solderability is tabulated as function of hotageing time. 4 refs.

Immersion Palladium Plating Bath

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Immersion phosphating of motor bodies before cathodic electropainting

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Vertical and horizontal immersion phosphating systems for motor bodies are described. Cleaning, rinsing, phosphating and passivation stages are considered.

Immersion Phosphating of Steel Sheet

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Immersion plating a solderable noble metal

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Process for plating a solderable noble metal, esp. palladium, onto substrate sufficiently electropositive to reduce the metal. Bath consists of Pd salt and complexant such as oxalic, glycolic or citric acid in pH range 0 to 5.5. Typical application is to plate Pd onto copper (alloy) of printed circuit boards. Non-toxic chemistry gives thin non-permeable (porosity) layer of highly solderable Pd.

Immersion Plating and Plated Structures.

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A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boiling point higher than a eutectic point in a phase diagram of the first and second metals. The bath is operated above the eutectic point but below the melting point of the second metal. For example, bismuth is immersion plated onto lead-free tin-based solder balls, and subsequently redistributed by fluxless reflow. Plated structures are also provided.

Immersion plating bath

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Aq. immersion plating bath comprising salt(s) of Sn(II), Pb, Bi, In, Ga and Ge; 1 or more of thiourea compound(s), imidazole thione(s); and amidine(s).

Immersion Plating Bath for Tin & Tin Lead Alloy onto Copper or Alloys

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Immersion Plating Copper onto Zinc with Agitated Bath Containing Copper Oxide

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Immersion Plating Gold onto Titanium

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Immersion plating of aluminium alloy pistons

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The effect of solution composition on tin plating of aluminium alloy pistons was investigated. The solution should preferably contain an organic sulphonic acid or its salt. The plating mechanism is discussed.

Immersion Plating of Bismuth Tin Alloy

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Acid aq. tin & Bi alkane sulphonate sol'n where Sn:Bi > 30:1, Bi is < 1 gm/litre.

Immersion plating of bronze

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Brief history of work on title displacement (cementation) solutions. Graph shows dep'n rate as function of tin sulphate conc'n, passing through max. at 5 gm/litre. Copper content of deposit & dep'n rates are plotted vs. bath composition & temperature & conc'n of organic additive, 1-hydroxyethylidene diphosphonic acid (HEDP) & tartaric acid. Auger depth profiles are shown, hydrogen sulphide tarnish test & immersion in salt water corrosion data are tabulated. 7 refs

Immersion Plating of Copper-Tin Alloy on Steel and Iron

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A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt. The influences of main components were discussed. The properties of plating solution and alloy deposit were determined. It forms a silver-white, bright and fine deposit with good adhesion, covering power and matching with upper deposit. The process was possible to replace cyanide copper-tin alloy plating technique.

Immersion Plating of Metal Powders

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