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Identification of Fused Tin Coatings on Integrated Circuit Device Leads

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Etching & microscopic observation of grain size allows fused tin coatings to be distinguished from solder and other similar coatings in what is broadly a spot test. Microphotos. 4 refs.

Identification of heavy metal toxicity levels in solid wastes by chemical speciation

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Technique for chemical speciation of heavy metals is suggested, which enables identification of heavy metal toxicity levels in solid wastes. Technique differentiates metals into geochemical phases: (i) 'easily and freely leachable and exchangeable', (ii) 'oxidisable-organic', (iii) 'acid-reducible', and (iv) 'resistant or residual'. Heavy metals analysed in most solid wastes are pref. sorbed within organic complex. Substantial fraction of metals are easily leachable or exchangeable. Comparisons are made with polluted lake and estuarine sediments to differentiate metal-sorption specificity. Release of heavy metals from solid wastes as function of time and chemical environment can be assessed.

Identification of hot corrosion resistant MCrAlY based bond coatings for gas turbine engine applications

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SURF Attempt was made to identify hot corrosion resistant coatings producing thermodynamically stable and inert oxide scale during exposure to hot corrosion environment and enhance coating life. NiCoCrAlY coating exhibits max. life time. Trace elements reduce coating life significantly. Novel electrochemical mechanism is proposed. Hot corrosion of protective coatings is electrochemical phenomena and techniques appear useful in evaluating coatings for hot corrosion resistance.

Identification of interelectrode gap sizes in pulse electrochemical machining

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JES Pulse electrochemical machining offers improvements in dimensional accuracy as compared with conventional electrochemical machining. Primary issue in pulse electrochemical machining is to identify and control interelectrode gap size. Presents identification method for gap size by in-process analysis of machining current pulses. Stochastic modelling and analysis of current pulses reveal 2 gap indicators: pulse signal variance and damping ratio. Variance has linear relationship with gap size within commonly used gaprange of 0.10 to 0.20 mm for wide range of pulse durations.Damping ratio is highly correlated with gap size. Laboratory experiments confirm feasibility of method under unevenly distributed gap conditions.

Identification of Intermetallic Compounds in Electrodeposited Copper Cadmium Alloys

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Anodic voltammetry was used to identify at least 4 intermetallic cmpds. in electrodeposits of Cu-Cd. 10 refs.

Identification of leptospira andamana isolated from the spinal fluid of a fatal case of leptospirosis in Sao Paulo.

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The IAL-S.P. strain was isolated from the spinal fluid of a patient male, aged 35, black, a sewer worker with fever,...its biological properties resist the oligodynamic action of copper and mercury and the 8-azoguanine action as in the case of the patoc. (Journal of Hygiene, Epidemiology, Microbiology, and Immunology) science.gov

Identification of leptospira andamana isolated from the spinal fluid of a fatal case of leptospirosis in Sao Paulo.

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The IAL-S.P. strain was isolated from the spinal fluid of a patient male, aged 35, black, a sewer worker with fever,...its biological properties resist the oligodynamic action of copper and mercury and the 8-azoguanine action as in the case of the patoc. (Journal of Hygiene, Epidemiology, Microbiology, and Immunology) science.gov

Identification of paint traces with forensic paint analysis methods

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Mainly describes title analysis following road accidents where traces of automotive paint allow type & make of vehicle to be established. Solubility tests, various spectroscopic methods, colour meas't, optical microscopy & SEM are all useful tools.

Identification of particulate surface contaminants using SEM & EDS

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Surface cleanliness testing where discrete particles as opposed to grease films etc are involved. Case study involves black spots on interior of electrical connectors. EDS & SEM images are shown, use of optical microscopy is also mentioned. The "black spots" were found to be ferrite dust from an adjacent ferrite core assembly operation. Cont'd p. 79

Identification of Phases in Electrodeposited Silver Palladium Alloys

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Anodic linear sweep voltammetry was used to identify phases in thin electrodeposited layers. Effects of alloy composition & film thickness on these is reported. 28 refs.

Identification of Roughness Defects in Decorative Nickel Chromium Electrodeposits

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Methods (optical & electron microscopy, electron probe microanalysis) for study of roughness are discussed. The origins of roughness such as inclusion of metallic & non-metallic incl. org. particles are examined. Many useful micrographs illustrating the points made. Comment that rough surfaces are not only aesthetically unacceptable but also have inferior corrosion resistance. Disc'n. p. 154.

Identification of Surface Chemical Compounds on Corroding Alloys

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Identification of Synthetic Organic Pigments by Characteristic Colour Reactions.

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Identification of synthetic organic pigments on the basis of colour reactions with four different chemical reagents: concentrated sulphuric acid, concentrated nitric acid, a mixture of concentrated sulphuric acid and concentrated nitric acid and a solution of potassium iodate in concentrated sulphuric acid. A wide range of known pigments were tested, flow charts were developed and the method was itself tested using six unknown pigments.

Identification of the ohmic-contact formation mechanism in the Au-Te/Au/GaAs system

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Contact formation mechanism for ohmic contacts on n-type GaAs are unclear for most metallizations which generally involve use of Au. Whether increased doping at gaAs side of junction or formation of graded Ga2Te3/GaAs transition layer takes place remains unverified. As doping of Ga2Te3 is reported and similar concept is proposed to hold for Au-Ge/ and Ge/Pd(n-type GaAs) metallizations as well.

Identification of the ohmic-contact formation mechanism in the Au-Te/Au/GaAs system

Relevancy:  

Contact formation mechanism for ohmic contacts on n-type GaAs are unclear for most metallizations which generally involve use of Au. Whether increased doping at gaAs side of junction or formation of graded Ga2Te3/GaAs transition layer takes place remains unverified. As doping of Ga2Te3 is reported and similar concept is proposed to hold for Au-Ge/ and Ge/Pd(n-type GaAs) metallizations as well.