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344 results. per page « 1 2 3 4 5 6 7 8 9 10 11 »

Kinetic effects in film formation of CuInSe2 prepared by chemical spray pyrolysis

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Kinetic Electrode Reactions in Silver Electrodeposition using a Multipulse Current Measurement.

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JES

Kinetic Features of Cadmium Electrodeposition in Iodide Water-Acetone Electrolytes.

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Kinetic features of cadmium electrodeposition in iodide water-acetone electrolytes.

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Kinetic H/D isotope effect in electroless copper plating. DEMS study

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Title & KW technique is used to investigate mechanism. 28 refs

Kinetic limitations on metal dissolution during aqueous silicon wafer processing

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JES Finite difference methods were used to model metal contamination removal from silicon wafers during aqueous processing. Copper was model species and its removal and redeposition rates are plotted, also its coverage as function of wafer geometry where it is seen that degree of contamination can vary by more than 1 order of magnitude across the wafer. 30 refs

Kinetic Method for Analysis of Cyanide Ion in Electroplating Effluents

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Title method is based on a spectrophotometric time-intensity plot at 560 nm, after add'n of simple reagents. The plot is calibrated using sol'ns of known CN conc'n. The importance of interfering species is discussed.

Kinetic model for diamond nucleation upon chemical vapor deposition

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DIAM Kinetic model for diamond nucleation on silicon substrate on CVD was proposed, based on surface reaction mechanism. Growth rate equation describing diamond nucleation was constructed, and from time-dependent solutions of this equation, important nucleation behavior was found in atom amount, which stable atomic cluster with diamond structure contains, exists max. value in deposition process of cluster.

Kinetic model for molecular beam epitaxial growth on a singular surface

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Presents new kinetic model for molecular beam epitaxial growth on singular surface which combines modified rate equations approach with concept of feeding zone. Model involves irreversible nucleation, growth and coalescence of 2D islands in each layer and consists of infinite set of coupled differential equations for adatom and 2D island densities and coverage in successive growing layers. In complete condensation regime and in absence of step edge barriers, homoepitaxial growth mode is fully determined by single dimensionless parameter proportional to ratio of surface diffusion coeff. and deposition flux. With decreasing this parameter, growth mechanism crosses over from smooth 2D layer-by-layer growth to rough multilayer growth and eventually to very rough Poisson random deposition growth with time-divergent rms roughness. Extension of model to case of heteroepitaxy by introducing different diffusion coeffs. in first and next layers is presented as well.

Kinetic Model of Electrodeposition of Arsenic Antimony Alloys

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Electrochemical study (impedance, polarisation etc) of electrodep'n onto rotating disk & stationary planar electrode from citric acid under steady state & non-steady state conditions. 11 refs.

Kinetic model of vapour-deposited thin film condensation: nucleation stage.

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Nucleation and growth of surface clusters are described. Growth process is divided into undercritical, near-critical and overcritical stages. For each, assumptions are made and solutions are joined at boundaries. Within undercritical region, distribution of nuclei is of equilibrium nature, while within near-critical region distribution is quasi-stationary. For overcritical region decay of clusters is negligible. Using approximations for nucleation rate and stable cluster growth rate, equations of condensation kinetics is solved analytically. Time dependence of supersaturation, nucleation rate, surface density of islands and cluster size distribution are found.

Kinetic modelling of film growth rate in atomic layer deposition

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JES

Kinetic Monte Carlo modeling of reaction-induced phase separation in Au/Ni(111) surface alloy.

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Kinetic of re-anodising porous alumina films

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The kinetics of barrier layer anodising, and a repeat, second anodising of an existing film are reported. Sketch shows where the further growth occurs. Voltage-time straight-line plots show data for anodising and re-anodising with two degrees of porosity. Graph plots the gradient of this vs current density for anodising & re-anodising. Concluded that re-anodising occurs at pore bottom and that apart from porosity, hemispherical curvature of pore bottom is important. 11 refs.

Kinetic parameters in cathodic electrodeposition of palladium I. Impedance measurements

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PROT In aq. electrolyte of chloride & chloride-perchlorate mixt's, meas'ts are reported at rest potential and steady state overpotentials at 283 to 343°K. The roles of mass transport and adsorption at the cathode are described.