Create your own FREE account with surfacequery.com and we will contact you with more details about a subscription or a one-off search.
Here you can perform a record search by entering keywords.
You can use the special keywords AND, OR and NOT in between words to refine your search.
This search also supports the wildcard character * and the use of quotes.
With a subscription or a one-off seach, the "author", "journal", "source", "date", "volume" and "page" details are presented along with the "abstract titles" and "anstracts".
Lapping apparatus
Relevancy:  
.
Lapping apparatus
Relevancy:  
Apparatus for lapping at high speeds with fine abrasive particles and rotatable abrasive platen.
Lapping apparatus
Relevancy:  
Lapping apparatus with upper and lower turntables and fittings to hold disk-shaped workpieces.
Lapping apparatus
Relevancy:  
In lapping apparatus with upper and lower turntables and disk-shaped workpiece holders between the these and defining receiving holes for workpieces.
Lapping composition
Relevancy:  
Lapping composition comprising mixture of base powder of plate alumina which has been milled and classified to form powder of 1st average grain size; and 0.3-15 wt% of 2nd powder of plate alumina milled and classified to average grain size 1.3-2.33 times greater than that of 1st powder.
Lapping head
Relevancy:  
Improved lapping head comprises means for supporting abrasive wheels each carried by corresponding shaft and, able to oscillate in direction of vertical axis.
Lapping machine
Relevancy:  
Lapping machine has platen stable to temp. change, of cast Fe alloy containing (wt%) 1-4 C, <38 Ni+Cu, <2 Si, <2 Mn, <0.1 S, <0.15 P, >0.1 Mg. Spherical graphite grains (<50µm dia.) are dispersed in cast Fe alloy.
Lapping machine
Relevancy:  
 
Lapping material
Relevancy:  
Lapping surface plate of material containing C 0.5-3.5, Si 1-7, Ni 5-15, Mn ¢1%, balance Fe, and with addition of ¢1% Mg, Ca and/or Ce, with graphite structure and hardness of =250 Hv, is produced without quenching or rapid cooling to improve use in lapping operations, e.g., on semiconductor substrates.
Lapping slurry
Relevancy:  
Thickened lapping slurry comprises abrasive grains dispersed in aq. carrier containing glycerine <80, triethanolamine 1-70 and water soluble silicate <10 wt%.
Lapping surfaces
Relevancy:  
A description of the new series of computer controlled ELC lapping machines manufactured by Melchiorre. Features include electrically controlled pressure and cooled lapping discs.
Lapping tape
Relevancy:  
Lapping tape comprising base and coat of abrasive particles consisting of acicular iron oxide powder (magnetite of opt. Co-containing gamma-Fe oxide) with surface area of _30m*2/g (BET method); and 2-30 % wt granular inorg. powder with Moh's hardness _7, coating having centerline mean roughness of 0.015-0. 025µm.
Lapping tape
Relevancy:  
Lapping tape with 3-25µm thick lapping layer formed of paint coating containing organic powders, binder and 20-60 wt% solvents with b.pt >120°C.
Lapping tape
Relevancy:  
Flexible lapping tape and 3-25µm lapping layer comprising paint with inorganic powder, binder and solvents. Last contains 20-60 wt% organic solvent of b.pt >120°C.
Lapping tools
Relevancy:  
Method of manufacturing spherical graphite cast Fe for lapping tools.