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Laminated electroplating rack

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Laminated electroplating rack

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Contact area of electroplating apparatus providing high current connections in small area to workpiece, may use dendrite surface to improve connection. Insulative gasket prevents access of soln. Heavy core laminated within supporting structure provides uniform current.

Laminated Metal Thin Plate Formed by Electrodeposition and Method of Producing the same.

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Electroforming of metallic multilayer structure of two metals or alloys, one with desirable mechanical properties, the second with desirable electrical properties, with repeated deposition of these alternating layers after which the structure is removed from the mandrel by dissolution of the latter.

Laminated polyester film for lamination to metal plate

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Laminated polyester film to be laminated to metal plate comprises 1st layer with surface roughness Ra 2-13nm,of aromatic copolyester composed of terephthalic acid and isophthalic acid, and ethylene glycol; and inert fine particles; and 2nd layer with Ra <15nm, of aromatic copolyester composed of ethylene terephthalate, and 2nd fine particles of aver. diam. 0.03-2.5µm.

Laminated polyester film for magnetic recording medium

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Laminated polyester film to be laminated on metal plate

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Insulating and corrosion resistant laminate comprising film consisting of 1st layer of aromatic copolyester containing terephthalic acid and ethylene glycol and 2nd layer of molten blend comprising 2nd aromatic polyester containing ethylene terephthalate, 3rd aromatic polyester containing tetramethylene terephthalate, and alkali metal. Film is laminated to metal plate and deep-drawn.

Laminated sheet metal for containers

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Laminated sheet metal comprising sheet metal with thermoplastic resin film, with intermediate primer resin layer containing polyaminocarboxylic acid modified epoxy resin 50-98, curing agent resin 2-50 and curing catalyst 0.2-10 wt%.

Laminated sheet steel for cans

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Laminated sheet steel for producing cans comprising steel sheet, chromium plated layer (5-150 mg/sq.m), hydrated Cr oxide layer (3-15mg/sq.m, based on Cr); bonding layer obtained by curing adhesive comprising 70-90% wt bisphenol A epoxy resin of number aver. mol. wt 15 000-30 000, remainder cresol phenol resin; biaxially oriented polyethylene terephthalate resin film; bonding layer being formed to define non-resin coated bands for welding, in lateral direction separated by bonding layer.

Laminated steel sheet for welded can

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Laminated steel sheet for welded can comprising steel sheet, plating layer with roughness, PPI, of 5-150 (PPI = no. of peaks per inch >0.05µm in top surface in cross section of plating layer). Plating layer comprises (a) tinning layer of 0.9-2. 8g/sq.m and (b) chemical treatment layer containing 5-50mg/sq.m metallic chromium and hydrated Cr oxide containing 5-25mg/sq.m metallic Cr; and resin film bonded by thermal compression on plating layer in band form; resin film being biaxially oriented film of polyethylene terephthalate copolymer with acid component of which 0.5-10 mol% is isophthalic acid.

Laminated strip as reflective vehicle trim

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Strip comprising steel or aluminium alloy of AA 3000, 5000, 6000 and 7000 series is cleaned; adhesive layer is applied; followed by 10-250µm polymer layer and up to 5000 Angstrom reflective metal layer, and at least 1 of chromium, steel, nickel and Al.

Laminated Structure for Electronic Equipment and Method of Electroless Gold Plating

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A laminated structure for electronic equipment includes a printed circuit board having copper foil, an undercoat plating layer made of tin or silver, formed on the printed circuit board, and a gold plating layer formed on the undercoat plating layer by electroless plating. Tin or silver is a metal which acts as an anticatalyst in electroless plating. After formation of the undercoat plating layer, the printed circuit board is dipped in catalyst-applying treating liquid to inhibit the anticatalyst.

Laminated structure of metal layer on conductive polymer

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Laminated structure comprising elec. insulating substrate carrying polymer layer comprising conductive portions with sheet resistance of max. 1000 ohm/sq., and pattern of 2nd non-conductive polymer whose sheet resistance is >10E6 or higher; metal layer being electrodeposited onto conductive 1st portion of polymer layer.

Laminated structure of metal layer on conductive polymer layer

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Polymer layer with electrically conductive areas having sheet resistance of >1000 Ohm/sq. and adjacent non-conductive areas with sheet resistance 10E6 or higher. E.g., copper is present on conductive areas. Conductive pattern may be generated photochemically and reinforced in aq. metal salt soln by electrodeposition of metal layer. Patterned exposure is described of 3, 4-ethylenedioxythiophene or polyaniline. Method is used on PCBs.

Laminated Textured Metal Coated Polyimide Film

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Laminated thin film disk for longitudinal recording

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Thin film magnetic disk comprising substrate; nonferromagnetic seed layer and underlayer; 1st ferromagnetic layer with [1010] pref. orientation; nonferromagnetic spacer layer; and 2nd ferromagnetic layer with [1010] pref. orientation.