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Pack cementation processing parameters for SiC coatings on C/C for optimum tribological properties.

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Pack chromizing internal surface of a component

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Heating to form gaseous chromium chloride.

Pack coating of articles with small passageways

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In protective coating metallic articles containing cooling holes by embedding in powder mix containing source of coating constituents, halide activator and inert ceramic material; and heating at 1500-2025°F; cooling holes are partially filled with aq. base organic coating, reducing tendency of powder mix to sinter in cooling holes.

Pack Diffusion Chromising Process for Nickel Superalloys

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Pack diffusion on an interlayer.

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Method for modifying a substrate with a diffusion layer comprises forming the diffusion layer made from a layer of nickel, nickel-tungsten, nickel-molybdenum or nickel-cobalt alloy as intermediate layer by subsequently applying an outer layer made from aluminum, chromium, silicon and/or titanium using a packing method or by chemical gas phase deposition in a simultaneous thermal treatment. Independent claims are also included for the following: (1) Diffusion-coated substrate produced by the above method; (2) Workpiece with the diffusion-coated substrate; and (3) Diffusion layer for arranging on a substrate.

Packaging dominates electronics systems. SMT/ES&S Hybrid '98 Show & Congress for System Integration in Microelectronics, Nuremberg

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Report on title event where major themes were Flip-Chip live in production, CAD/CAM, solder pastes & adhesives application, population, soldering, cleaning, inspection & test. Names & addresses of exhibitors are listed

Packaging dominates electronics systems. SMT/ES&S Hybrid '98 Show & Congress for System Integration in Microelectronics, Nuremberg

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Report on title event where major themes were Flip-Chip live in production, CAD/CAM, solder pastes & adhesives application, population, soldering, cleaning, inspection & test. Names & addresses of exhibitors are listed

Packaging material

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Apparatus for making packaging material using gaseous phase atmosphere photo CVD to apply barrier layer to moving web substrate.

Packaging of circuit board, gold plating solution & gold plating

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Packaging printed circuit board with bump forming to create needle like protrusions, using Au (III) sol'n, chelating agent of ethylenediamine or nitrotriacetate & stabliser which can be bipyridyl or 1-10 phenanthroline, neocuprin or imidazole.

Packaging Techniques for Electronic Systems

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Review of packaging including p.c.b, micromodules, encapsulation & electron beam welding. Disc'n p 139.

Packed bed cell for electrolytic treatment

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Electrolysis method of removing contaminants from aq. liquids by placing latter into vessel containing bed including solid particulate packing elements, some of which are in contact to form low electrical conductivity medium. Vessel includes cathode and anode with continuous bed between them forming conductive path.

Packed bed reactor for effluent treatment

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Packing density/surface morphology relationship in thin sputtered chromium films.

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PACVD nano-crystalline B-C-N thin films obtained by use of an organoboron precursor

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Pad and method for polishing device wafer.

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