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Radioluminescence study of surface and ceramic body of lustred majolicas.

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SFEN Title ceramic surfaces are studied. 9 refs

Radiometric Methods for Ultraviolet Process Design and Process Monitoring

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The differences between radiometric instruments and the reasons for these differences are explored, and suggestions are made on how to avoid some common errors and how to report data more completely. Optical terminology, specifications, methods, and how radiometric measures are used in design and in production monitoring are presented. 15 refs.

Radiopaque coating for biomedical devices.

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A medical device has a porous metallic coating that can withstand the high strains inherent in the use of such devices without delamination. A coating of the metal is applied to a medical device, such as a stent, by vapor deposition so that the thermomechanical properties of the stent are not adversely affected. The coating preferable has high emissivity. The coating is applied via a generally oblique coating flux or a low energy coating flux.

Radiopaque coatings for polymer substrates.

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Improved radiopaque coatings particularly suitable for polymer substrates. A modified ion plasma deposition (IPD) method is used to provide coatings with macroparticle-dense surfaces that have excellent radiopacity. The coatings are particularly adapted to polymer surfaces because of high adherence and resistance to peeling and flaking.

Radiopaque coatings for polymer substrates.

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Improved radiopaque coatings particularly suitable for polymer substrates. A modified ion plasma deposition (IPD) method is used to provide coatings with macroparticle-dense surfaces that have excellent radiopacity. The coatings are particularly adapted to polymer surfaces because of high adherence and resistance to peeling and flaking.

Radiotracer & electrochemical studies of the mechanism of passivating action of inhibitive anions

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Study of corrosion inhibitors incl. phosphates & carboxylates which require dissolved oxygen to maintain steel in passive state. Potential-time plots show effects of Na benzoate or borate, and behaviour of steel after previous immersion in K dichromate or benzoate. Radiotracer equipment is sketched and potentiostatic plots show effects. Pourbaix diagram shows behaviour of iron in 0.01M chromate sol'n. Brief mention of SIRS Raman effect for this type of study. 33 refs

Radiotracer Method for Automatic Control of Ion Exchange

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Title method is used for example to control IX plant removing Fe and Cr(III) from Cr(VI) effluent. No refs.

Radiotracer Studies of Addition Agent Behaviour 6. Coumarin & Melilotic Acid

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Coumarin is reduced at cathode to melilotic acid approx 10 times faster than it is incorporated in Ni deposit. C inclusions stem primarily from Coumarin.Data for C content of Ni as function temp & conc'n of org. species in sol'n. Data on ductility of Ni as function C content. Mechanistic analysis in terms of diffusion - adsorption process.

Radiotracer Study of Addition Agent Behaviour 5. Further Results for Thiourea, p-Toluenesulphonamide.

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Focus on C inclusions from thiourea & S incorporation from saccharin & PTolS. Ads'n is related to temp. & also structure of Ni deposit. Graphs showing these effects & dis'n of mechanism.

Radiotracer Study of Addition Agent Behaviour Pt II. Adsorption on Metals from Thiourea Solutions

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Sulphidation occurs on brass surfaces in thiourea-cont'g solutions, the rate of reaction is initially diffusion controlled. Chemisorption of unreacted Th. mols also occurs. In Ni plating baths with low conc'ns of Th., sulphidation rate falls off with time as result of complex formation. Graphs of surface conc'n of S as function Th. conc'n in sol'n, time of immersion, and as function of time after add'n of Th. to Ni-plating sol'ns. Surface conc'n data for C also.

Radiotracer Study of Addition Agent Behaviour Pt III. Inclusion of Sulphur in Nickel

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Rate of S inclusion from saccharin or o-tol. sulphonamide sol'ns reaches limiting value at relatively low conc'ns. Adsorption - desorption behaviour determines amt. of included S. Value of overpotential & deposit characteristic is also related to S inclusions. Saccharin is preferentially adsorbed over o-toluene sulphonamide. Graphs of S content vs sol'n conc'n of organics. taken singly and together in varying ratios. S content vs c.d.

Radiotracer Study of Addition Agent Behaviour. Pt 1. Inclusion of Sulphur & Carbon in Nickel

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The incorporation of S from thiourea-cont'g sol'ns is diffusion controlled, and so proportional to Th. conc'n and independant of c.d. pH has only slight effect. C conc'n is much less than S, showing that Th. decomposes at cathode and also at the anode. Changes in sol'n comp'n do not affect the above but do alter polarisation. Graphs of S content in Ni as function Th. conc'n, c.d, temp, pH. Tables of C content. i-V data as function of time in presence of thiourea and the same for H2S. Rate of consumption of Th. Relationship between anode & cathode activities. Disc'n pp. 123-125.

Radiotracer Study of Addition Agent Behaviour: 4. Mechanism of Incorporation

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The diffusion & adsorption (either of which might be rate controlling) of p-toluenesulphonamide, saccharin & thiourea.

Radiotracer Study of Addition Agents 7. Quinoline Methiodide, Succindinitrile & Other Addition Agent

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Study of role of title cmpds & their interaction with other organic addition agents in Ni plating. C14 data on C inclusion in deposits under range of dep'n conditions. Cathode Eff'cy as function succindinitrile conc'n. Data on S inclusion from saccharin with and w/o title cmpds. Cathode pot'l as function sol'n comp'n. Data on ductility & internal stress as function of conc'n of title cmpds. Micrographs of deposit structure, effect of add'n agents on grain size. Other exp'tl data to examine mechanisms. Disc'n pp 137-8.

Radiotracer Study of Addition Agents 8. Benzene Ring Incorporation from Coumarin & Melilotic Acid

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Not just atomic C & S but entire org. mols such as melilotic acid are included during Ni plating. Data is given showing C incorporation and also number of benzene rings, as function of c. d & other plating conditions. Effects on ductility are discussed.