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Tantalum sputtering targets

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Inexpensive sputtering target for deposition of Ta and TaN(x) films with fewer particles and less dispersion of resistivity values.

Tantalum-based multilayer coating on cobalt alloys in total hip and knee replacement.

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Ta carbide and metallic Ta coatings deposited using a thermal treatment in molten salts, patented by Spriano & Bugliosi was used.

Tantalum-containing barrier layers for copper

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Amorphous barrier layer to line opening to be filled with Cu is formed by sputter depositing Ta or Ta nitride in opening; then sputter depositing alternate (Ta nitride or Ta) to line bottom and side walls; and repeating until layer is amorphous.

Tantalum/silica interference filter

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Making Ta/SiO2 interference filter >3.5µm thick which retains integrity at >600°C by depositing by low pressure CVD 1st and 2nd Ta/SiO2 coatings, separated by heat treatment step.

Tape Adhesion Test with Determination of Removed Coating

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Tape Automated Bonding - Review of Current Technology

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Overview with comments and single-layer untestable and 3-layer testable tapes, bump plating; inner & outer lead bonding. Photos & sketches. 9 refs

Tape Automated Bonding. Review of Current Technology

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Overview covers needs for TAB & wire bonding, TAB requiring bump chips, TAB types, single & 3-layer tapes, BTAB using standard chips untestable tape (bumped & other), inner & outer lead bonding. Sketches & SEM's show assemblies. 23 refs

Tape for chromium coating process

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Coating tape useful in applying Cr coating to substrate, comprises source layer incl. powdered source of Cr, solid reactant which reacts with solid Cr at elevated temp. to produce gaseous Cr compound, inert Cr oxide powder and source layer binder; and porous media incl. inert powdered ceramic and binder.

Tape for cleaning magnetic head

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Tape for rough surfaces

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Adhesive tape for rough surfaces comprising deformable backing, adhesive layer and release material.

Tape-type magnetic recording medium

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Taper etching semiconductor in gas plasma

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Tapered dry etching

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Dry etching method comprising forming positive mask with vertical edges on substrate, mask having vertical edges from polymeric photoresist material isotropically corroded by plasma action, contacting masked substrate with plasma under conditions producing anisotropic etching of substrate and controlled isotropic erosion of mask, and continuing plasma contact until desired end point is reached producing tapered hole(s) in substrate.

Tapered edges on integrated optoelectronic devices

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Method for etching tapered edge on cladding layer of integrated optical waveguide by applying layer of cladding to substrate; applying curable liquid as droplet on edge with liquid forming taper; curing and simultaneously etching curable liquid and cladding to replicate taper into cladding.

Tapered sidewall with multi-step etching process

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Method for making tapered opening for IC having feature size of ca. 1mm which is to be filled with metallurgy conductor.