Register

Create your own FREE account with surfacequery.com and we will contact you with more details about a subscription or a one-off search.

More details…

Search

Here you can perform a record search by entering keywords.

You can use the special keywords AND, OR and NOT in between words to refine your search.

This search also supports the wildcard character * and the use of quotes.

Subscription or one-off search

With a subscription or a one-off seach, the "author", "journal", "source", "date", "volume" and "page" details are presented along with the "abstract titles" and "anstracts".

More details…

1544 results. per page « 2 3 4 5 6 7 8 9 10 11 12 »

Ultra-thin coatings for corrosion control

Relevancy:  

Ultra-thin coatings are based on self-assembly molecules (SAMs) which contain group able to react with metal substrate, and group which will react with applied paint. Various compounds were investigated. Alkydphosphonic acid and phosphoric acid monoalkyl esters were suitable anchoring groups for aluminium, and incorporation of isocyanate groups provides binding to paint.

Ultra-Thin Copper Foil with Carrier, Method of Production of same, and Printed Circuit Board using Ultra-Thin Copper Foil with Carrier.

Relevancy:  

An ultra-thin copper foil with a carrier having as peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra -thin copper foil to be easily peeled apart, and reduced in the number of pinholes by uniform plating without impairing the peelability of the peeling layer, that is, an ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer and the ultra-thin copper foil are provided between them with a strike plating layer at the surface on the peeling layer side, an ultra -thin layer of copper is provided on this according to need, and an ultra -thin copper foil comprised of copper or a copper alloy or a phosphorus-containing copper or phosphorus-containing copper alloy is provided. The peeling layer between the carrier foil and the ultra-thin copper foil is chromium, a chromium alloy, a chromium-containing oxide hydrate layer, nickel, iron, or an alloy layer of the same or an oxide hydrate layer of the same.

Ultra-thin copper wire for high-reliability interconnects

Relevancy:  

Ultra-thin copper wire is produced by electroforming using special additives to the electrolyte, and can be used in micro-electronics. More details from Thomas Moffet at www.eeel.nist.gov/omp/interconnect/html

Ultra-thin flex pcb substrate

Relevancy:  

Substrate for flex printed circuit boards, already copper laminated from Circuit Foil. Process uses scrap Cu from cable industry. Bath additives create nodular deposit structure for reduced surface roughness but improved adhesion. Description of production process, comment on product testing, details on output statistics, financial turnover etc.

Ultra-thin hybrid organic/inorganic gas barrier coatings on polymers.

Relevancy:  

Ultra-thin metal oxide films

Relevancy:  

Method comprises preparing thin film comprising fatty acid metal soap(s); an exposing to UV and ozone to produce metal oxide thin film.

Ultra-thin metal sandwich layers

Relevancy:  

Multilayer laminated electrodeposits, e.g of copper & nickel sulphide (sulphur) or Cu & nickel manganese were deposited. SEM's show cross-sections & details of bath compositions are given. Some trials also with Ni tungsten. Potentiodynamic plots show polarisation data with substrate effects in evidence. 41 refs

Ultra-thin Multilayer Printed Circuit Boards - a New Generation ?

Relevancy:  

Discussion of MCM's, mobile telephones, PCMCIA cards, roll-to-roll innerlayer processing. Ultrathin laminates are detailed & tables list core thickness standards.

Ultra-thin noble metal coatings for electronic packaging

Relevancy:  

Ultra-thin composite of noble metal layers on Ni surface in which composite is 2.5-11 µin. thick and incl. succession from Ni, 0.5-3.5 µin. Pd or Au strike; 0.5-5µin. thick Pd-Ni alloy layer (10-90 % wt Ni) Pd; and 0-1µin. Au. Au is used when high speed of solder wetting is desired. Coating is pref. applied by reel-to-reel metal deposition.

Ultra-thin noble metal coatings for electronic packaging

Relevancy:  

Ultra-thin composite of noble metal layers on Ni surface in which composite is 2.5-11µin. thick and incl. succession from Ni, 0.5-3.5µin. Pd or Au strike; 0.5-5µin. thick Pd-Ni alloy layer (10-90 % wt Ni) Pd; and 0-1µin. Au. Au is used when high speed of solder wetting is desired. Coating is pref. applied by reel-to-reel metal deposition.

Ultra-thin noble metals for electronics packaging

Relevancy:  

Pref. reel-to-reel electroplating process for depositing ultra-thin composite 2.5-11µin. thick, with, successively from Ni, 0.5-3.5µin. thick Pd or Au strike; 0.5-5µin thick Ni-Pd alloy layer (10-90% wt Ni); and 0-1µin. thick Au layer. Au layer is used for high-speed solder wetting.

Ultra-thin noble metals for electronics packaging

Relevancy:  

Pref. reel-to-reel electroplating process for depositing ultra-thin composite 2.5-11µin. thick, with, successively from Ni, 0.5-3.5µin. thick Pd or Au strike; 0.5-5µin thick Ni-Pd alloy layer (10-90% wt Ni); and 0-1µin. thick Au layer. Au layer is used for high-speed solder wetting.

Ultra-thin palladium coatings for cost-savings in the electronics industry

Relevancy:  

Reports a proprietary Pd electrolyte Pallacor HT, pH 6.8 - 7.5, and operated at 20 to 50°C giving a deposit of 250 to 270 HV25 of 99.7 to 99.9% purity.Deposition was studied with quartz crystal microbalance. Graph shows frequency change of this for electrodeposition of nickel, Pd and gold.. Graph shows Pd deposition rate at 5,7, 10 g/l at room temperature. Histograms show very low deposit porosity as compared with other Pd electrolytes. Extensive data is given for electrical contact resistance. 11 refs

Ultra-thin palladium cobalt- gold surface finishes for electronic packaging

Relevancy:  

Comments on physical properties of Pd & alloys, and graph suggesting its cost os lower and less volatile than gold. Use of title coating system on leadframes is reported incl. treatment prior to wirebonding & solderability test, adhesion (pull force data) and effects on this of gold flash. Pull force as function of bonding temperatures. Solderbility test results & Auger depth profiles are given. The new system meets the adhesion & solderability requirements, offers significant cost savings. 7 refs incl. US patent covering this.

Ultra-thin palladium deposits for cost-savings in the electronics industry

Relevancy:  

Against a background of turbulent gold prices, the use of palladium in electronics applications is attractive. A detailed study of palladium electrodeposition using a quartz crystal microbalance is presented. Graphs show output for QCM for nickel, palladium, gold. A proprietary palladium electrolyte is used. Histograms and graphs shows porosity as function of thickness and other parameters. Solderability and efficacy of palladium as a thermal barrier layer are also investigated. Electrical contact resistance and wirebonding behaviour are reported. 11 refs