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179 results. per page « 1 2 3 4 5 6 7 8 9 10 11 12 »

X-Ray Study of the Kinetics of Thick-Layer Pulse Anodizing of Aluminium

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X-Ray study of Tin Nickel Electrodeposits

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X-ray study of tin-nickel deposits and effects of electro-deposition conditions. Lattice data are given for intermetallic species formed. Discussion on pp 161-169.

X-ray study of tin oxide films obtained by reactive DC sputtering from a metallic tin target in pure oxygen plasma.

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X-Ray Techniques as a Tool to Analyse Intermetallic Coatings

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Use of title methods (fluorescence & diffraction) to study composite coatings, e.g oxidised boron or NbSi, is described with traces and graphs of results. 27 refs.

X-Ray Testing of Coating Thickness & Composition

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X-Ray Thickness Measurement of Aluminide Coated on Nickel Alloy Turbine Blade

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X-Ray Thickness Measurement of Selectively Plated Connectors

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Advocates title method, minimal data.

X-Ray Thickness Testing for Continuous Plating

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report with no refs of the title process, including a discussion of the ASTM & ISO standards, and diagrams of the process and typical results. Effect of sample distance from head are shown.

X-Ray Thickness Tube & Detector

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X-Y displacement & self-alignment in reflow soldering with lead-free

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Photos compare tin-lead with tin-silver-copper for which table compares properties.

X. Pinhole, pit and porosity of deposit.

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XANES studies of the formation of Ag-nanoparticles in LbL deposited polyelectrolyte thin films.

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Xenon and Additive Short Arc Illuminators: their Capabilities and Applications.

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The characteristics are reported of short-arc (at least 10 mm) high pressure lamps using Xe and/or an additive metal fill. Metal reflectors produced by the electroforming process are described. The combination of short arc lamp and deep-dish electroformed reflector was compared to other collection methods, and applications were explored.

Xenon and Molybdenum Ion Implantation on Austenitic Stainless Steel: Structural Modification.

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Xenon enhanced plasma etch

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Si wafer is etched by provided gas mixture comprising CF3Br and xenon or krypton, contacting wafer with plasma formed from mixture, and eroding C bearing object with plasma.